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374324B00035G | |
|---|---|
DigiKey Part Number | HS318-ND |
Manufacturer | Boyd Laconia, LLC |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Product Attributes
Type | Description | Select All |
|---|---|---|
Category | ||
Mfr | ||
Series | ||
Packaging | Box | |
Part Status | Active | |
Type | Board Level | |
Package Cooled | ||
Attachment Method | Thermal Tape, Adhesive (Included) | |
Shape | Square, Pin Fins | |
Length | 1.063" (27.00mm) | |
Width | 1.063" (27.00mm) | |
Diameter | - | |
Fin Height | 0.394" (10.00mm) | |
Power Dissipation @ Temperature Rise | 3.0W @ 90°C | |
Thermal Resistance @ Forced Air Flow | 9.30°C/W @ 200 LFM | |
Thermal Resistance @ Natural | 30.60°C/W | |
Material | ||
Material Finish | Black Anodized | |
Shelf Life | - | |
Base Product Number |
0 In Stock
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Quantity
All prices are in USD
Box
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | $3.50000 | $3.50 |
| 10 | $3.09600 | $30.96 |
| 25 | $2.94960 | $73.74 |
| 50 | $2.84300 | $142.15 |
| 100 | $2.74020 | $274.02 |
| 250 | $2.60996 | $652.49 |
| 648 | $2.48096 | $1,607.66 |
| 1,296 | $2.39100 | $3,098.74 |
Tariff Status: Tariff may apply if shipping to the United States. Tariff costs are calculated and will be displayed in the shopping cart.
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