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TS391SNL50 | |
|---|---|
DigiKey Part Number | TS391SNL50-ND |
Manufacturer | |
Manufacturer Product Number | TS391SNL50 |
Description | THERMALLY STABLE SOLDER PASTE NO |
Manufacturer Standard Lead Time | 3 Weeks |
Customer Reference | |
Detailed Description | Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g) |
Datasheet | Datasheet |
Product Attributes
Type | Description | Select All |
|---|---|---|
Category | ||
Manufacturer | Chip Quik Inc. | |
Series | - | |
Packaging | Bulk | |
Part Status | Active | |
Type | Solder Paste | |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
Diameter | - | |
Melting Point | 423 ~ 428°F (217 ~ 220°C) | |
Flux Type | No-Clean | |
Wire Gauge | - | |
Mesh Type | 4 | |
Process | Lead Free | |
Form | Jar, 1.76 oz (50g) | |
Shelf Life | 12 Months | |
Shelf Life Start | Date of Manufacture | |
Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) | |
Shipping Info | - | |
Base Product Number |
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Quantity
All prices are in USD
Bulk
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | $17.95000 | $17.95 |
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