TS991SNL500T3 | |
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DigiKey Part Number | 315-TS991SNL500T3-ND |
Manufacturer | |
Manufacturer Product Number | TS991SNL500T3 |
Description | SOLDER PASTE THERMALLY STABLE NC |
Manufacturer Standard Lead Time | 4 Weeks |
Customer Reference | |
Detailed Description | Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g) |
Datasheet | Datasheet |
Type | Description | Select All |
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Category | ||
Manufacturer | Chip Quik Inc. | |
Series | ||
Packaging | Bulk | |
Part Status | Active | |
Type | Solder Paste | |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
Diameter | - | |
Melting Point | 423°F (217°C) | |
Flux Type | No-Clean | |
Wire Gauge | - | |
Mesh Type | 3 | |
Process | Lead Free | |
Form | Jar, 17.64 oz (500g) | |
Shelf Life | 12 Months | |
Shelf Life Start | Date of Manufacture | |
Base Product Number |
Quantity | Unit Price | Ext Price |
---|---|---|
1 | $107.19000 | $107.19 |
5 | $97.21400 | $486.07 |
10 | $87.24400 | $872.44 |
25 | $79.76560 | $1,994.14 |
50 | $74.78040 | $3,739.02 |
100 | $69.79500 | $6,979.50 |