



374324B60023G | |
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DigiKey Part Number | HS522-ND |
Manufacturer | |
Manufacturer Product Number | 374324B60023G |
Description | BGA HEAT SINK |
Manufacturer Standard Lead Time | 6 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level |
Datasheet | Datasheet |
Type | Description | Select All |
---|---|---|
Category | ||
Mfr | ||
Series | ||
Packaging | Bulk | |
Part Status | Active | |
Type | Board Level | |
Package Cooled | ||
Attachment Method | Solder Anchor | |
Shape | Square, Pin Fins | |
Length | 1.063" (27.00mm) | |
Width | 1.063" (27.00mm) | |
Diameter | - | |
Fin Height | 0.394" (10.00mm) | |
Power Dissipation @ Temperature Rise | 1.5W @ 50°C | |
Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 500 LFM | |
Thermal Resistance @ Natural | 30.60°C/W | |
Material | ||
Material Finish | Black Anodized | |
Base Product Number |
Quantity | Unit Price | Ext Price |
---|---|---|
1 | $3.63000 | $3.63 |
10 | $3.21600 | $32.16 |
25 | $3.06400 | $76.60 |
50 | $2.95320 | $147.66 |
216 | $2.73236 | $590.19 |
432 | $2.63343 | $1,137.64 |
648 | $2.57719 | $1,670.02 |
1,080 | $2.50799 | $2,708.63 |