TS391AX50

DigiKey Part Number
TS391AX50-ND
Manufacturer
Manufacturer Product Number
TS391AX50
Description
THERMALLY STABLE SOLDER PASTE NO
Manufacturer Standard Lead Time
3 Weeks
Customer Reference
Detailed Description
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 1.76 oz (50g)
Datasheet
 Datasheet
Product Attributes
Type
Description
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Category
Manufacturer
Chip Quik Inc.
Series
-
Packaging
Bulk
Part Status
Active
Type
Solder Paste
Composition
Sn63Pb37 (63/37)
Diameter
-
Melting Point
361°F (183°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Leaded
Form
Jar, 1.76 oz (50g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
68°F ~ 77°F (20°C ~ 25°C)
Shipping Info
-
Base Product Number
0 In Stock
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All prices are in USD
Bulk
QuantityUnit PriceExt Price
1$13.95000$13.95
Manufacturers Standard Package